Comp3d

R25 of 3D ACIS Modeler and 3D InterOp

Spatial’s integrated portfolio of 3D solutions enables customers to become more competitive by providing the most advanced 3D capabilities for 3D application development. R25 includes increased PMI capabilities, advanced feature detection, and support for Model-Based Engineering (MBE) / Model-Based Definition (MBD). 

R25 enhancements to both 3D ACIS and 3D InterOp leverages the performance capabilities of any underlying hardware the end user is using. New “out of the box” capabilities, such as multi-thread and multi-processing, without special programming are now available.

R25 Highlight Videos

Learn how to becom emore competitive with the new 3D capabilities in Spatial's R25 release

 

 

 Complimentary Webinar R25

 

3D ACIS Modeler Enhancements

  • New Boolean features that simplify manufacturing workflows.
  • Easy handling of non-exact geometry, allowing more intelligent, effective re-use of geometry, which saves time and allows designers and engineers to focus on innovation.
  • New functionality for feature recognition enabling designers to edit feature level geometry without the need to edit the model history to be used for visualization, analysis and simulation. This capability was specifically designed for the EDA market and the modeling of printed circuit boards where the features can easily be in the thousands.

3D InterOp for Data Reuse Enhancements

  • Support for additional 3D data formats (DXF, DWG, STL and those commonly used in the automotive market), allowing Spatial’s customers to reach into new markets and industries.
  • Expanded PMI capabilities–both graphical and semantic, allowing Spatial’s customers to provide capabilities to support MBE/MBD initiatives.